In the working stage of printed circuit boards there’s a copper deposition inside the holes designed to lodge the contacts of the various electronic components to the circuit board itself. This operation is very delicate and it requires a high and consistent current, that only dimensionally stable anodes are able to supply compared to the soluble copper anodes.
A solution of Copper Sulphate and Sulphuric Acid is used, with additives to increase the penetrating power of the deposition and its evenness within the holes, which typically have a diameter smaller than one millimetre.
The Titanium + Iridium Oxide anode is structured in a way to reduce the consumption of additives, which are quite expensive, through an inactive porous Oxide calibrated thickness over-coating, which hinders the large additives’ organic molecules’ migration, towards the surface of the anode reducing its destruction.
Chemical Newtech manufactures this type of Anode, based on the client’s drawing, using the coating specifically designed for this particular geometry, usually a stretched net.